SMT 無 鉛 錫 膏 Lead-Free Solder Paste
採用無鉛未含鹵素之先進助焊劑及無氧超音波製程球型錫粉所調配形成,並有絕佳的可靠性,所使用之助焊劑乃為低活化性無需清洗。 Lead Free solder paste using Lead-free manufactured with the atomized gas and centrifugal spraring methods, powder is fine, processes a truly spherical shape, less oxidation and mixed with high technical flux. Furthermore, excellent reliablitly can be obtained with the flux without washing.
特點
  • 使用無鉛(錫、銀、銅系列) 錫粉混合物,符合RoHS 標準。
  • 晶片側極少發生錫球。
  • 印刷性非常安定連續使用粘度變化微少。
  • 有極佳之焊接效果,對於元件之沾錫性有一定之良好效應。
  • 有氮、無氮均適合迴焊。
Features
  • Lead-free (Sn/Ag/Cu series) solder alloy is used and RoHs compliant.
  • Excellent printability with fine patterns can be obtained.
  • Stable printability is obtained with little change in viscosity during continuous printing.
  • Having a good solderability, adequate wettability is shown on various parts.
  • Can be used in air-reflow and N2 reflow processes.
特 性    Specifications
項目
ITEMS
FL705
合金成份
Composition
Sn 96.5 / Ag 3.0 / Cu 0.5
溶點
Melting Point
217°C
錫粉形狀
Shape of Solder Powder
真圓
Spherical
錫粉末粒子徑
Particle Size
20-45μm
粘度(25°C / 10 r.p.m.)
Viscosity
190±30Pa.s
FLUXS 含量
Flux Content
11.5±0.2wt%
氯 含量
Chloride Content

Nil
氟化物含量
Halogen content

Nil
溶融性
Solder ball test
無錫球產生
Solder balls seldom occur
擴散性
Solder spread test
82% 以上
腐蝕性
Copper plate corrosion test
無腐食
No corrosion
殘渣粘度
Tackiness test of residue
通過
Pass
加熱移位性
Slump test
Less than 0.15mm 以下
水溶液阻抗
Water solution resistance test
1X105Ω
絕緣阻抗
Insulation resistance test
40°C/90%RH 1.0X1011Ω
以上
潮濕試驗
Wettability test
鋼板性質 Steel plate 1
黃銅板性質 Copper plate 1~2