無 鉛 高 抗 氧 化 銲 錫 條 Lead-Free A.U. Solder Bar
本公司無鉛高抗氧化錫條,符合RoHS國際標準 ,採用99.99% 純度極高之純錫製造。控制pb合量在100 ppm內。以特殊方式處理,將一般銲錫之氧化物(及即錫渣)除去。當銲錫熔融時,氧化物之發生量較一般銲錫減少了將近一半,且銲錫表面能保持較久時間,對於作業上之改善及產品品質之改良均有良好成效。 Our Lead- Free solders bar is RoHS compliant, the alloy composition of the solder is now dominated by 99.99% solder materials. Lead content is equal or less than 100ppm. Our solder is specially treated to remove oxides. The result is a much lower level ( around 50% ) of oxides during melting, making the solder easier to handle and reducing waste. Even without the addition of anti-oxidation elements, our solder resists oxidation and will retain a clean surface much longer then common solder.
特點
  • 濕潤性及焊接方面表現良好。
  • 不熔解後氧化物(錫渣)之發生量較一般銲錫減低近半。
  • 錫爐表面光澤如鏡,且液相體較佳,銲接性能更好,減低浪費。
  • 本產品已具有防止氧化作用,若錫爐內再微量添加抗氧油脂,則氧化殆無。
Features
  • Good performance in wettability and solderability
  • Oxide occuring after melting approximately 50% less than common solder.
  • Solder has highly reflective surface and low viscosity, for improved soldering and reduced waste
  • Naturally anti-oxidizing; with the addition of small amounts of anti-oxidizing agents, oxidation can be reduced to almost nil
物 理 性 及 包 裝    Physical Properties / Package
產品型號
Products No.
MCB 01 MCB 02
成份%
Composition%
Sn99.3, Cu0.7 Sn99.3, Cu0.7
溶點
Melting Point ℃
227 ℃ 227 ℃
比重
Specific Gravity
7.3 7.3
熱膨脹率
Diameter mm or inch
19.1 μm/m℃ 20.2 μm/m℃
包裝
Package
20 KGS / Carton
機 械 性 質    Mechanical Properties
產品型號
Products No.
MCB 01 MCB 02
抗張強度
Tensile Strength (Mpa)
42.1 45.6
屈服強度
Yield Strength (Mpa)
33.5 38.6
最大張力
Max Percent Strain (WT%)
77.5 78
屈服所需能量
Energy to Yield Point (Joules)
0.136 0.203
斷裂所需能量
Energy to Break Point (Joules)
18.56 18.01
韌性
Toughness (Mpa)
27.10 26.30
抗疲勞循環
Cycle Fatigue Resistance Nf
1125 2500
絕緣抵抗值
Surface Insulation Resistance
>1E + 12 ohms >1E + 12 ohms